Taipei, Taiwan, September 11 2025 -- QuantumDiamonds proudly announces the release of its flagship tool, the QD m.1, bound to release in Q1 2026, which revealed at SEMICON Taiwan 2025 as the next-generation failure localization tool for non-destructive analysis for advanced semiconductor technologies:

Novel non-destructive failure localization tool for advanced packaging and wide bandgap power electronics. Built on brand new and patented quantum sensing technology, the QD m.1 delivers high resolution and high sensitivity depth-resolved analysis for advanced semiconductor architectures.

New Application Note, a collaboration with Integrated Service Technology (iST), showcases electrical activity imaging of a failed A12  Integrated Fan-Out Package-on-Package (InFO_PoP) device. The study demonstrates the advantages of the quantum sensing technology, and its synergies with existing failure analysis technologies that customers are used to.

Release of the Demo Tool Program in 2026 for early-access industry partners. The program includes on-site installation, training, and full application support for live evaluation of QD m.1 on customer use cases.

The QD m.1 represents a major milestone, marking the transition from QuantumDiamonds prototype tool (QD m.0), which has been used in early-stage collaborations and feasibility studies. Built on brand new quantum sensing technology, QD m.1 is a non-destructive magnetic imaging tool designed for advanced failure analysis. It enables fault localization in XY and Z by visualizing current flow through the magnetic fields generated by electrical currents. Using quantum defects in diamond sensor technology, it provides exceptional spatial resolution and sensitivity, making it a powerful diagnostic tool for complex and emerging technologies such as advanced packaging, 2.5D/3D ICs, chiplets, and wide bandgap materials.

“We developed QD m.1 to meet the diagnostic demands of today’s and tomorrow’s semiconductor devices,” says Fleming Bruckmaier, CTO and Co-Founder of QuantumDiamonds. “It allows magnetic imaging at high resolution and sensitivity, without interfering with your devices, and delivers results in minutes.”

A versatile tool for a broad range of applications

The QD m.1 tool is designed to address failure analysis challenges across a wide spectrum of device architectures and material platforms, including:

• Advanced Packaging & HBM - QD m.1 enables non-destructive failure localization with depth information in complex architectures like 2.5D/3D integration and chiplets, where traditional methods struggle to access buried interconnects.
• Wide Band-Gap Materials (GaN, SiC) - The tool provides high-sensitivity magnetic imaging for detecting subtle defects and current paths in GaN, SiC, and hybrid devices used in high-power and high-frequency applications.
• Material Science - QD m.1 offers a unique tool for imaging electrical activity in emerging materials such as graphene and TMDs, delivering quantum-level insights into next-generation semiconductor research.

Imaging shorts in InFO_PoP packages

To demonstrate the capabilities of the QD m.1 in a realistic failure analysis workflow, QuantumDiamonds, in collaboration with iST, has released a new application note featuring backside analysis of two InFO_PoP samples.

InFO_PoP is a leading advanced packaging platform for high-performance and lightweight applications such as System-on-Chip (SoC) packages, combining logic and memory in a compact footprint frequently utilized in smartphones like the iPhone. The study presents a typical backside analysis case after a failed pin IV. EMMI was first used to detect a backside hotspot in the failing A12 device, followed by high-resolution magnetic imaging with QD m.1 to visualize current flow and image the line leading up to a buried short-type failure near a passive component.

By directly mapping current paths and identifying where they diverge from expected behavior, QD m.1 revealed a clear electrical defect signature, all non-destructively and in under 10 minutes per device. This case study highlights the power of QD m.1 to complement conventional failure analysis tools and improve success rates in complex multi-layered packages.

QuantumDiamonds 2026 Demo Tool Program

QuantumDiamonds is partnering with selected companies and research institutes to offer early access to the QD m.1 through its 2026 Demo Tool Program:

• Receive on-site installation and hands-on training to accelerate adoption.
• Keep the system for up to 8 weeks, with clear KPIs and a mid-point tech review.
• Benefit from applications engineering and field support to explore relevant use-cases and maximize value from your QD m.1 deployment.