April 14, 2026 -- Wave Photonics has launched PIC testing services and a Test Design Kit (TDK) on the PDK Management Platform, expanding the platform's complementary services across the photonic design, validation, and packaging workflow.

The service supports high-throughput, parallelised measurement and performance analysis for passive photonic integrated circuits (PICs) at both die level and wafer scale. It complements existing capabilities available through platform partners, helping designers move more efficiently from design to fabrication, testing, and packaging within a connected ecosystem

Their services support:

• 100 mm, 150 mm, and 200 mm wafer-scale testing
• Passive PIC characterisation at 780 nm and 1500-1630 nm
• Up to two-week turnaround for wafer scale measurement and analysis
• Compatibility with their QPICPAC packaging service, enabling wafer-level testing to identify the best dies before packaging

The measurement outputs include raw spectra, fitted curves, and wafer-level statistical analysis, providing detailed insight into device performance and variability.

The TDK defines the layout and design requirements needed to design chips for reliable optical characterisation using Wave Photonics’ probing infrastructure. By making these requirements accessible through the platform, they enable designers to account for testing earlier in the design process, reducing design iterations and improving first-time success.